Sealing mechanism for sealing a vacuum chamber

ABSTRACT

A sealing mechanism comprises a support member forming part of the semiconductor producing apparatus which has a vacuum chamber, a rotation shaft rotatably received in the support member, and at least three seal rings axially spaced apart from each other between the support member and the rotation shaft to form a first fluid chamber close to the atmosphere and a second fluid chamber close to the vacuum chamber. The first fluid chamber is vacuumized to have a first pressure, and the second fluid chamber is also vacuumized to have a second pressure which is lower than the first pressure. The first and second fluid chambers work together to enhance the sealing performance of the sealing mechanism.

CROSS REFERENCE TO RELATED APPLICATION

This application is a division of application Ser. No. 09/417,308 filedOct. 13, 1999, entitled “Sealing Mechanism for Sealing a VacuumChamber,” now U.S. Pat. No. 6,296,255.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a sealing mechanism for sealing avacuum chamber, and more particularly to a sealing mechanism for sealinga vacuum chamber formed in the semiconductor producing apparatus to beshut down from its exterior.

2. Description of the Related Art

In general, the semiconductor producing apparatus of this kind ismaintained vacuumized and highly pure in air for producing such productsbecause dusts and other foreign materials are detrimental to wafers andother semiconductor materials in the process of producing thesemiconductor producing apparatus. The semiconductor producing apparatusis usually required to be operated by some kinds of driving mechanismsuch as a manipulator driven by a drive shaft to handle semiconductordevices, LCD base plates and other objects to be treated. The driveshaft has axial portions extending inside and outside of a vacuumchamber formed in the semiconductor producing apparatus. This means thatthe gaps between the axial portions of the drive shaft and the otherparts' around the axial portions of the drive shaft are required to betightly sealed to have the vacuum chamber maintained at a constantvacuum level.

In recent years, meanwhile, the process of producing semiconductors hasremarkably been progressed to obtain more excellent performance, higherdensity and integration for the products. The process, however, tends tohave a relatively low productivity as compared with other industrialproducts. This is due to the fact that dusts and foreign materialsdetrimental to wafers and other semiconductor materials are apt to enterthe vacuum chamber of the semiconductor producing apparatus. The dustsand foreign materials which may cause inferior products are each made ofa particle generally larger than the thickness of an insulator layer tobe turned into a semiconductor. At the present time, strenuous effortscontinue to be made for reducing to as a lowest level as possible suchdusts and foreign materials each having a size larger than the thicknessof the insulator layer. These strenuous efforts have not yet becomesuccessful.

The typical conventional semiconductor producing apparatus is partlyshown in FIG. 15 and FIG. 16 and comprises a manipulator 210 drivablyinstalled in the vacuum chamber 261 of the semiconductor producingapparatus which is vacuumized through an aperture 201 formed in the wallof the semiconductor producing apparatus.

The manipulator 210 is shown in FIG. 15 and FIG. 16 as having a driveshaft 250 which is rotatably supported on a support member 240. The wallportion 202 of the semiconductor producing apparatus is formed with ahole 202 a having the support member 240 fixedly received therein. Thedrive shaft 250 shown in FIG. 15 has a forward end portion extending inthe vacuum chamber 261 to pivotally support first and second arms 213and 214, and a handling member 215 operatively coupled with the firstand second arms 213 and 214 so that the handling member 215 can beoperated to handle semiconductor devices, LCD base plates and otherobjects to be treated. Also, the drive shaft 250 has a rear end portionextending in the atmosphere 260 and drivably connected with drivingmeans constituted by an electric motor and reduction gears which are notshown in the drawings.

The drive shaft 250 is shown in FIG. 16 as comprising a firstcylindrical shaft 230 rotatably received in the support member 240through bearings 216 a and a second cylindrical shaft 220 rotatablyreceived in the first cylindrical shaft 230 through bearings 216 b.

One typical example of the conventional sealing mechanisms is also shownin FIG. 16 to comprise a first group 218 of magnetic fluid seals axiallyarranged between the support member 240 and the first cylindrical shaft230, and a second group 219 of magnetic fluid seals axially arrangedbetween the first and second cylindrical shafts 230 and 220. The twogroups 218 and 219 of magnetic fluid seals can function to maintain thevacuum chamber 261 in a hermetically sealed state, resulting in the factthat dusts and foreign materials, i.e., fine particles generated fromfrictional contacts between elements or parts outside of the vacuumchamber 261 can be prevented from entering the vacuum chamber 261.

The conventional sealing mechanism mentioned in the above is of aperformance having a resistant pressure of 0.2 atmospheric pressure foreach of the magnetic fluid seals 218 and 219. From this reason, theconventional sealing mechanism is required to comprise a plurality ofmagnetic fluid seals 218 axially disposed in a series between thesupport member 240 and the first cylindrical shaft 230, and a pluralityof magnetic fluid seals 219 also axially disposed in a series betweenthe first and second cylindrical shafts 230 and 220 as described in theabove.

The above known sealing mechanism, however, encounters such a problemthat the dusts and foreign materials cannot fully be prevented fromentering the vacuum chamber and that the vacuum chamber thus cannot bemaintained at a constant vacuum level.

It is, therefore, an object of the present invention to provide asealing mechanism suitable for sealing a vacuum chamber formed in thesemiconductor producing apparatus.

It is another object of the present invention to provide a sealingmechanism having an excellent sealing performance to seal a vacuumchamber formed in the semiconductor producing apparatus.

SUMMARY OF THE INVENTION

According to the first aspect of the present invention there is provideda sealing mechanism for sealing a vacuum chamber formed in thesemiconductor producing apparatus, comprising: a rotation shaft drivento be rotatable around its own axis and having an outer surface in theform of a cylindrical shape; a support member intervening between thevacuum chamber and the atmosphere and rotatably supporting the rotationshaft to have the rotation shaft received therein, the support memberhaving an inner surface in the form of a cylindrical hollow shape andfirst and second axial ends respectively extending in the atmosphere andthe vacuum chamber, the inner surface of the support member being largerin diameter than the outer surface of the rotation shaft, the supportmember being formed with a first fluid passageway having a first end anda second end and a second fluid passageway having a first end and asecond end open toward the vacuum chamber; first and second seal ringspositioned between the rotation shaft and the support member in axiallyspaced-apart relationship with each other to hermetically seal the gapbetween the rotation shaft and the support member under the state thatthe first seal ring is located in the neighborhood of the first axialend of the support member and remote from the second axial end of thesupport member and that the second seal ring is located in theneighborhood of the second axial end of the support member and remotefrom the first axial end of the support member, the rotation shaft, thesupport member, and the first and second seal rings collectively forminga first fluid chamber held in communication with the first fluidpassageway through the first end of the first fluid passageway; an airsucking unit having a port held in communication with the second end ofthe first fluid passageway to maintain the pressure of the first fluidpassageway at a level between the atmospheric pressure and the innerpressure of the vacuum chamber; a third seal ring positioned between therotation shaft and the support member in axially spaced-apartrelationship with the second seal ring between the second seal ring andthe extension plane radially inwardly extending and flush with thesecond axial end of the support member to hermetically seal the gapbetween the rotation shaft and the support member, the rotation shaft,the support member, and the second and third seal rings collectivelyforming a second fluid chamber held in communication with the secondfluid passageway through the first end of the second fluid passageway;and a fluid filter disposed on the portion of the support member exposedto the vacuum chamber to cover the second end of the second fluidpassageway.

According to the second aspect of the present invention there isprovided a sealing mechanism as set forth in claim 1 in which thesupport member is formed with an additional first fluid passageway andan additional second fluid passageway.

According to the third aspect of the present invention there is provideda sealing mechanism for sealing a vacuum chamber formed in thesemiconductor producing apparatus, comprising: a first rotation shaftdriven to be rotatable around its own axis and having an outer surfacein the form of a cylindrical shape; a second rotation shaft driven to berotatable around its own axis and rotatably receiving therein the firstrotation shaft, the second rotation shaft having an inner surface in theform of a cylindrical hollow shape, first and second axial endsrespectively extending in the atmosphere and the vacuum chamber, and anouter surface in the form of a cylindrical shape, the inner surface ofthe second rotation shaft being larger in diameter than the outersurface of the first rotation shaft, the second rotation shaft beingformed with a first fluid passageway having first and second endsrespectively open at the inner and outer surface of the second rotationshaft and a second fluid passageway having first and second endsrespectively open at the inner and outer surface of the second rotationshaft; a support member intervening between the vacuum chamber and theatmosphere and rotatably supporting the second rotation shaft to havethe second rotation shaft received therein, the support member having aninner surface in the form of a cylindrical hollow shape and first andsecond axial ends respectively extending in the atmosphere and thevacuum chamber, the inner surface of the support member being larger indiameter than the outer surface of the second rotation shaft, thesupport member being formed with a third fluid passageway having a firstend and a second end and a fourth fluid passageway having a first endand a second end open toward the vacuum chamber; first and second sealrings positioned between the first and second rotation shafts in axiallyspaced-apart relationship with each other to hermetically seal the gapbetween the first and second rotation shafts under the state that thefirst seal ring is located in the neighborhood of the first axial end ofthe second rotation shaft and remote from the second axial end of thesecond rotation shaft and that the second seal ring is located in theneighborhood of the second axial end of the second rotation shaft andremote from the first axial end of the second rotation shaft, the firstand second rotation shafts and the first and second seal ringscollectively forming a first fluid chamber held in communication withthe first fluid passageway through the first end of the first fluidpassageway; a third seal ring positioned between the first and secondrotation shafts in axially spaced-apart relationship with the secondseal ring between the second seal ring and extension plane radiallyinwardly extending and flush with the second axial end of the secondrotation shaft to hermetically seal the gap between first and secondrotation shafts, the first and second rotation shafts and the second andthird seal rings collectively forming a second fluid chamber held incommunication with the second fluid passageway through the first end ofthe second fluid passageway; fourth and fifth seal rings positionedbetween the second rotation shaft and the support member in axiallyspaced-apart relationship with each other to hermetically seal the gapbetween the second rotation shaft and the support member under the statethat the fourth seal ring is located in the neighborhood of the firstaxial end of the support member and remote from the second axial end ofthe support member and that the fifth seal ring is located in theneighborhood of the second axial end of the support member and remotefrom the first axial end of the support member, the second rotationshaft, the support member, and the fourth and fifth seal ringscollectively forming a third fluid chamber held in communication withthe first fluid passageway through the second end of the first fluidpassageway and the third fluid passageway through the first end of thethird fluid passageway; an air sucking unit having a port held incommunication with the second end of the third fluid passageway tomaintain the pressure of the third fluid passageway at a level betweenthe atmospheric pressure and the inner pressure of the vacuum chamber; asixth seal ring positioned between the second rotation shaft and thesupport member in axially spaced-apart relationship with the fifth sealring between the fifth seal ring and the extension plane radiallyinwardly extending and flush with the second axial end of the supportmember to hermetically seal the gap between the second rotation shaftand the support member, the second rotation shaft, the support member,and the fifth and sixth seal rings collectively forming a fourth fluidchamber held in communication with the second fluid passageway throughthe second end of the second fluid passageway and the fourth fluidpassageway through the first end of the fourth fluid passageway; and afluid filter disposed on the portion of the support member exposed tothe vacuum chamber to cover the second end of the fourth fluidpassageway.

According to the second aspect of the present invention there isprovided a sealing mechanism as set forth in claim 3 in which the secondrotation shaft is formed with an additional first fluid passageway andan additional second fluid passageway, and the support member is formedwith an additional third fluid passageway and an additional fourth fluidpassageway.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects, features and advantages of the present invention willbecome apparent as the description proceeds when taken in conjunctionwith the accompanying drawings, in which:

FIG. 1 is a fragmentary cross-sectional view of a first embodiment ofthe sealing mechanism according to the present invention;

FIG. 2 is an enlarged cross-sectional view of a support member formingpart of the sealing mechanism shown in FIG. 1;

FIG. 3 is a fragmentary perspective view of each of first and secondembodiments of the seal rings forming part of the sealing mechanismshown in FIGS. 1 and 12, the seal rings shown in FIG. 3 being positionedin axially parallel relationship with each other and remotest to thevacuum chamber formed in the semiconductor producing apparatus;

FIG. 4 is an enlarged fragmentary perspective view surrounded by thecircle IV of FIG. 3;

FIG. 5 is a cross-sectional view taken on the line V—V of FIG. 4;

FIG. 6 is a fragmentary perspective view similar to FIG. 3 but showingeach of other embodiments of the seal rings forming part of the sealingmechanism shown in FIGS. 1 and 12;

FIG. 7 is an enlarged fragmentary perspective view surrounded by thecircle VII of FIG. 6;

FIG. 8 is a cross-sectional view taken on the line VIII—VIII of FIG. 7;

FIG. 9 is a fragmentary perspective view of each of first and secondembodiments of the seal rings forming part of the sealing mechanismshown in FIGS. 1 and 12, the seal rings shown in FIG. 9 being positionedclosest to the vacuum chamber formed in the semiconductor producingapparatus;

FIG. 10 is an enlarged fragmentary perspective view surrounded by thecircle X of FIG. 9;

FIG. 11 is a cross-sectional view taken on the line XI—XI of FIG. 10;

FIG. 12 is a fragmentary cross-sectional view similar to FIG. 1 butshowing a second embodiment of the sealing mechanism according to thepresent invention;

FIG. 13 is an enlarged cross-sectional view of a second rotation shaftforming part of the sealing mechanism shown in FIG. 12;

FIG. 14 is an enlarged cross-sectional view of a support member formingpart of the sealing mechanism shown in FIG. 12;

FIG. 15 is a fragmentary cross-sectional view of the conventionalsemiconductor producing apparatus; and

FIG. 16 is a cross-sectional view similar to FIG. 12 but showing aconventional sealing mechanism.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Throughout the following detailed description, similar referencecharacters and numbers refer to similar elements in all figures of thedrawings.

Referring to FIGS. 1 and 2 of the drawings, there is shown a firstpreferred embodiment of the sealing mechanism according to the presentinvention. The sealing mechanism is shown in FIGS. 1 and 2 as comprisinga rotation shaft 20 driven to be rotatable around its own axis andhaving an outer surface 20 a in the form of a cylindrical shape. Therotation shaft 20 is adapted to be rotated by suitable driving meanswhich is not shown in the drawings but is constituted by an electricmotor and a reduction gear in a similar manner to the conventionalsemiconductor producing apparatus.

The sealing mechanism further comprises a support member 40 interveningbetween the vacuum chamber 11 and the atmosphere 10 and rotatablysupporting the rotation shaft 20 to have the rotation shaft 20 receivedtherein through two axially spaced bearings 14 and 15. The supportmember 40 forms part of the semiconductor producing apparatus having thevacuum chamber 11. The semiconductor producing apparatus has a wall 12partly shown in FIG. 1 and fixed to the support member 40 by bolts 13.The support member 40 has an inner surface 40 a in the form of acylindrical hollow shape and first and second axial ends 40 b and 40 crespectively extending in the atmosphere 10 and the vacuum chamber 11.The above-mentioned inner surface 40 a of the support member 40 islarger in diameter than the outer surface 20 a of the rotation shaft 20.The support member 40 is formed with a plurality of first fluidpassageways 41 each having a first end 41 a and a second end 41 b and aplurality of second fluid passageways 42 each having a first end 42 aand a second end 42 b open toward the vacuum chamber 11.

While there have been described in the above about the fact that thesupport member 40 is formed with the plurality of first fluidpassageways 41, the plurality of first fluid passageways 41 may bereplaced by a single first fluid passageway 41, according to the presentinvention. Similarly, the plurality of second fluid passageways 42 maybe replaced by a single second fluid passageway 42.

The sealing mechanism further comprises first and second seal rings 51and 52 positioned between the rotation shaft 20 and the support member40 in axially spaced-apart relationship with each other to hermeticallyseal the gap between the rotation shaft 20 and the support member 40under the state that the first seal ring 51 is located in theneighborhood of the first axial end 40 b of the support member 40 andremote from the second axial end 40 c of the support member 40 and thatthe second seal ring 52 is located in the neighborhood of the secondaxial end 40 c of the support member 40 and remote from the first axialend 40 b of the support member 40. The rotation shaft 20, the supportmember 40, and the first and second seal rings 51 and 52 collectivelyform a first fluid chamber 61 held in communication with the first fluidpassageway 41 through the first end 41 a of the first fluid passageway41.

The sealing mechanism further comprises an air sucking unit 70 having aport 70 a held in communication with the second end 41 b of the firstfluid passageway 41 to maintain the pressure of the first fluidpassageway 41 at a level between the atmospheric pressure and the innerpressure of the vacuum chamber 11.

The sealing mechanism further comprises a third seal ring 53 positionedbetween the rotation shaft 20 and the support member 40 in axiallyspaced-apart relationship with the second seal ring 52 between thesecond seal ring 52 and the extension plane radially inwardly extendingand flush with the second axial end 40 c of the support member 40 tohermetically seal the gap between the rotation shaft 20 and the supportmember 40. The rotation shaft 20, the support member 40, and the secondand third seal rings 52 and 53 collectively form a second fluid chamber62 held in communication with the second fluid passageway 42 through thefirst end 42 a of the second fluid passageway 42.

The sealing mechanism further comprises a fluid filter 80 disposed onthe portion of the support member 40 exposed to the vacuum chamber 11 tocover the second end 42 b of the second fluid passageway 42.

The sealing mechanism further comprises stop means for stopping thefirst to third seal rings 51, 52, and 53 from moving toward the vacuumchamber 11 with respect to the rotation shaft 20 and the support member40. In this embodiment of the sealing mechanism, the stop means isconstituted by first to third rings 91, 92, and 93 which are fastenedselectively to the rotation shaft 20 and the support member 40 torespectively stop the first to third seal rings 51, 52, and 53 frommoving toward the vacuum chamber 11.

To ensure that the frictions between the first to third seal rings 51,52, and 53 and the rotation shaft 20 and between the first to third sealrings 51, 52, and 53 and the support member 40 are reduced to a minimumlevel, as a small level as possible, the outer surface 20 a of therotation shaft 20 and the inner surface 40 a of the support member 40are coated with a tetrafluoroethylene layer.

As will be seen in FIGS. 3 to 5, each of the first and second seal rings51 and 52 comprises an annular retaining member 101 formed with anannular groove 101 a, and an annular spring member 102 tightly receivedin the annular groove 101 a and retained by the annular retaining member101 to resiliently bias the annular retaining member 101 to expandradially outwardly.

The annular retaining member 101 is made of a resilient material and theannular spring member 102 is made of a metal. The above-mentionedresilient material includes rubber and synthetic resin mainly containinga polyethylene. The annular spring member 102 is made of a strip in theform of a helical shape. The annular spring member 102 is covered by theannular retaining member 101. Each of the first and second seal rings 51and 52 has a center axis 101 b passing therethrough and is of a circularcross-section taken on the plane perpendicular to the center axis 101 b.

While each of the first and second seal rings 51 and 52 comprises anannular retaining member 101 and an annular spring member 102 which areshown in FIGS. 3 to 5 in this embodiment, the first and second sealrings 51 and 52 may comprise an annular retaining member 103 and anannular spring member 104 which are shown in FIGS. 6 to 8 in place ofthe annular retaining member 101 and the annular spring member 102 whichare shown in FIGS. 3 to 5 according to the present invention.

As will be seen in FIGS. 6 to 8, each of the first and second seal rings51 and 52 comprises an annular retaining member 103 formed with anannular groove 103 a, and an annular spring member 104 tightly receivedin the annular groove 103 a and retained by the annular retaining member103 to resiliently bias the annular retaining member 103 to expandradially outwardly.

The annular retaining member 103 is made of a resilient material and theannular spring member 104 is made of a metal. The above-mentionedresilient material includes rubber and synthetic resin mainly containinga polyethylene. The annular spring member 104 is made of a strip in theform of a helical shape. The annular spring member 104 is covered by theannular retaining member 103. Each of the first and second seal rings 51and 52 has a center axis 103 b passing therethrough and is of atriangular cross-section taken on the plane perpendicular to the centeraxis 103 b.

As will be seen in FIGS. 9 to 11, the third seal ring 53 comprises anannular retaining member 105 formed with an annular groove 105 a, and anannular spring member 106 tightly received in the annular groove 105 aand retained by the annular retaining member 105 to resiliently bias theannular retaining member 105 to expand radially outwardly.

The annular retaining member 105 is made of a resilient material and theannular spring member 106 is made of a metal. The above-mentionedresilient material includes rubber and synthetic resin mainly containinga polyethylene. The annular spring member 106 is made of a strip in theform of a helical shape. The annular spring member 106 is covered by theannular retaining member 105. The third seal ring 53 has a center axis105 b passing therethrough and is of a channel-shaped cross-sectiontaken on the plane perpendicular to the center axis 105 b. As best shownin FIG. 1, the annular groove 105 a of third seal ring 53 has an endopen toward the second fluid chamber 62.

The operation of the sealing mechanism will be described hereinlater.

The vacuum chamber 11 of the semiconductor producing apparatus isusually controlled to be vacuumized to the pressure level for example at5×10⁻⁴ Pa while the semiconductor producing apparatus is being operated.At this time, the pressure of the second fluid chamber 62 is maintainedat a pressure level substantially equal to that of the vacuum chamber11. This results in having the pressure 1×10⁵ Pa of the atmosphere 10and the pressure 5×10⁻⁴ Pa of the vacuum chamber 11 differ from eachother at an extremely high level, for example, 1×10⁵-5×10⁻⁴ Pa. Thispressure difference leads to generating an axial force to move the sealrings toward the vacuum chamber 11, with the result that the first,second, and third seal rings 51, 52, and 53 are liable to abruptly bedisplaced from their respective home positions if external forces suchas for example vibrations are generated from other mechanical elementsor parts forming the semiconductor producing apparatus. The abruptdisplacements of the first, second, and third seal rings 51, 52, and 53may cause dusts and other foreign materials to enter the vacuum chamber11 as well as may bring about the pressure fluctuation in the vacuumchamber 11, thereby lessening the productivity of the semiconductor.

In the first embodiment of the sealing mechanism mentioned in the above,there is provided the first and second fluid chambers 61 and 62 axiallyjuxtaposed between the rotation shaft 20 and the support member 40 toovercome the above problems the prior art encounters. The first fluidchamber 61 is sucked through the first fluid passageway 41 by the airsucking unit 70 to be maintained at a pressure lower than theatmospheric pressure but higher than those of the second fluid chamber62 and the vacuum chamber 11. It is thus to be noted that the dusts andother foreign materials are discharged and sucked through the firstfluid passageway 41 by the air sucking unit 70 while the pressure of thefirst fluid chamber 61 is maintained at its optimum pressure level,i.e., lower than the atmospheric pressure but higher than those of thesecond fluid chamber 62 and the vacuum chamber 11 to prevent the abruptpressure drop in the vacuum chamber 11. This function of the first fluidchamber 61 is cooperated with the function of the second fluid chamber62 to enhance the effectiveness of the sealing mechanism according tothe present invention.

From the above description, it will be understood that the first,second, and third seal rings 51, 52, and 53 work together to preventdusts and other foreign materials from entering the vacuum chamber 11 aswell as to prevent the pressure of the vacuum chamber 11 from droppingover its allowable level. More specifically, the first, second, andthird seal rings 51, 52, and 53 axially spaced apart from each other toform the first and second fluid chambers 61 and 62 can result in thefact that the dusts and other foreign materials entering the first fluidchamber 61 can be removed through the first fluid passageway 41 by theair sucking unit 70 to prevent the dusts and other foreign materialsfrom entering the second fluid chamber 62 and the vacuum chamber 11while the pressure of the vacuum chamber 11 is not dropped rapidly dueto the first and second fluid chambers 61 and 62 provided between thevacuum chamber 11 and the atmosphere 10.

In a usual manner, the sealing mechanism is operated to have the secondseal ring 52 serve as completely sealing between the second seal ring 52and the support member 40 and between the second seal ring 52 and therotation shaft 20. Sometimes, there occur vibrations and othermechanical motions of the elements or parts of the semiconductorproducing apparatus to impart shocks to the second seal ring 52. Whensuch the vibrations and other mechanical motions of the elements orparts of the semiconductor producing apparatus are generated, the smallgaps are formed between the second seal ring 52 and the support member40 and between the second seal ring 52 and the rotation shaft 20. Thesmall gaps lead to introducing the air in the first fluid chamber 61into the second fluid chamber 62 because the pressure of the first fluidchamber 61 is always maintained at a level higher than that of thesecond fluid chamber 62. The air entering the second fluid chamber 62comes to be equal in pressure to the air in the vacuum chamber 11 by thereason that the second fluid chamber 62 is held in communication withthe vacuum chamber 11 through the filter 80. If, at this time, the airintroduced into the second fluid chamber 62 happens to contain dusts andother foreign materials, these materials are prevented from entering thevacuum chamber 11 by the filter 80 and by no means fly and scatter inthe air of the vacuum chamber 11.

On the other hand, the aforementioned fact that the air entering thesecond fluid chamber 62 becomes equal in pressure to the air in thevacuum chamber 11 means that the third seal ring 53 between the secondfluid chamber 62 and the vacuum chamber 11 does not undergo anypressure, i.e., axial force caused in the second fluid chamber 62 andthe vacuum chamber 11, thereby making it possible to completely preventthe air in the second fluid chamber 62 from entering the vacuum chamber11 through the gap between the third seal ring 53 and the support member40 and between the third seal ring 53 and the rotation shaft 20. Noaxial force and pressure imparted on the third seal ring 53 can renderthe contacting pressure on the support member 40 and the rotation shaft20 extremely small in value so that no dusts is generated by thefriction between the third seal ring 53 and the support member 40 andbetween the third seal ring 53 and the rotation shaft 20.

Referring to FIGS. 12 to 14 of the drawings, there is shown a secondpreferred embodiment of the sealing mechanism according to the presentinvention. The sealing mechanism is shown in FIGS. 12 to 14 ascomprising a first rotation shaft 120 driven to be rotatable around itsown axis and having an outer surface 120 a in the form of a cylindricalshape.

The sealing mechanism further comprises a second rotation shaft 130driven to be rotatable around its own axis and rotatably receivingtherein the first rotation shaft 120 through two axially spaced bearings114 and 115. The second rotation shaft 130 has an inner surface 130 a inthe form of a cylindrical hollow shape, first and second axial ends 130b and 130 c respectively extending in the atmosphere 10 and the vacuumchamber 11, and an outer surface 130 d in the form of a cylindricalshape. The above-mentioned inner surface 130 a of the second rotationshaft 130 is larger in diameter than the outer surface 120 a of thefirst rotation shaft 120. The second rotation shaft 130 is formed with aplurality of first fluid passageways 131 each having first and secondends 131 a and 131 b respectively open at the inner and outer surface130 a and 130 d of the second rotation shaft 130 and a plurality ofsecond fluid passageways 132 each having first and second ends 132 a and132 b respectively open at the inner and outer surface 130 a and 130 dof the second rotation shaft 130.

The sealing mechanism further comprises a support member 140 interveningbetween the vacuum chamber 11 and the atmosphere 10 and rotatablysupporting the second rotation shaft 130 to have the second rotationshaft 130 received therein through two axially spaced-bearings 116 and117. The support member 140 forms part of the semiconductor producingapparatus having the vacuum chamber 11. The semiconductor producingapparatus has a wall 112 partly shown in FIG. 12 and fixed to thesupport member 140 by bolts 113. The support member 140 has an innersurface 140 a in the form of a cylindrical hollow shape and first andsecond axial ends 140 b and 140 c respectively extending in theatmosphere 10 and the vacuum chamber 11. The above-mentioned innersurface 140 a of the support member 140 is larger in diameter than theouter surface 130 d of the second rotation shaft 130. The support member140 is formed with a plurality of third fluid passageways 141 eachhaving a first end 141 a and a second end 141 b and a plurality offourth fluid passageways 142 each having a first end 142 a and a secondend 142 b open toward the vacuum chamber 11.

While there have been described in the above about the fact that thesecond rotation shaft 130 is formed with the plurality of first fluidpassageways 131, the plurality of first fluid passageways 131 may bereplaced by a single first fluid passageway 131, according to thepresent invention. Similarly, the plurality of second fluid passageways132 may be replaced by a single second fluid passageway 132, and theplurality of third fluid passageways 141 may be replaced by a singlethird fluid passageway 141, and the plurality of fourth fluidpassageways 142 may be replaced by a single fourth fluid passageway 142.

The sealing mechanism further comprises first and second seal rings 151and 152 positioned between the first and second rotation shafts 120 and130 in axially spaced-apart relationship with each other to hermeticallyseal the gap between the first and second rotation shafts 120 and 130under the state that the first seal ring 151 is located in theneighborhood of the first axial end 130 b of the second rotation shaft130 and remote from the second axial end 130 c of the second rotationshaft 130 and that the second seal ring 152 is located in theneighborhood of the second axial end 130 c of the second rotation shaft130 and remote from the first axial end 130 b of the second rotationshaft 130. The first and second rotation shafts 120 and 130 and thefirst and second seal rings 151 and 152 collectively form a first fluidchamber 161 held in communication with the first fluid passageway 131through the first end 131 a of the first fluid passageway 131.

The sealing mechanism further comprises a third seal ring 153 positionedbetween the first and second rotation shafts 120 and 130 in axiallyspaced-apart relationship with the second seal ring 152 between thesecond seal ring 152 and extension plane radially inwardly extending andflush with the second axial end of the second rotation shaft 130 tohermetically seal the gap between first and second rotation shafts 120and 130. The first and second rotation shafts 120 and 130 and the secondand third seal ring 152 and 153 collectively form a second fluid chamber162 held in communication with the second fluid passageway 132 throughthe first end 132 a of the second fluid passageway 132.

The sealing mechanism further comprises fourth and fifth seal rings 154and 155 positioned between the second rotation shaft 130 and the supportmember 140 in axially spaced-apart relationship with each other tohermetically seal the gap between the second rotation shaft 130 and thesupport member 140 under the state that the fourth seal ring 154 islocated in the neighborhood of the first axial end 140 b of the supportmember 140 and remote from the second axial end 140 c of the supportmember 140 and that the fifth seal ring 155 is located in theneighborhood of the second axial end 140 c of the support member 140 andremote from the first axial end 140 b of the support member 140. Thesecond rotation shaft 130, the support member 140, and the fourth andfifth seal rings 154 and 155 collectively form a third fluid chamber 163held in communication with the first fluid passageway 131 through thesecond end 131 b of the first fluid passageway 131 and the third fluidpassageway 141 through the first end 141 a of the third fluid passageway141.

The sealing mechanism further comprises an air sucking unit 170 having aport 170 a held in communication with the second end 141 b of the thirdfluid passageway 141 to maintain the pressure of the third fluidpassageway 141 at a level between the atmospheric pressure and the innerpressure of the vacuum chamber 11.

The sealing mechanism further comprises a sixth seal ring 156 positionedbetween the second rotation shaft 130 and the support member 140 inaxially spaced-apart relationship with the fifth seal ring 155 betweenthe fifth seal ring 155 and the extension plane radially inwardlyextending and flush with the second axial end 140 c of the supportmember 140 to hermetically seal the gap between the second rotationshaft 130 and the support member 140. The second rotation shaft 130, thesupport member 140, and the fifth and sixth seal ring 155 and 156collectively form a fourth fluid chamber 164 held in communication withthe second fluid passageway 132 through the second end 132 b of thesecond fluid passageway 132 and the fourth fluid passageway 142 throughthe first end 142 a of the fourth fluid passageway 142.

The sealing mechanism further comprises a fluid filter 180 disposed onthe portion of the support member 140 exposed to the vacuum chamber 11to cover the second end 142 b of the fourth fluid passageway 142.

The sealing mechanism further comprises stop means for stopping thefirst to third seal rings 151, 152, and 153 from moving toward thevacuum chamber 11 with respect to the first and second rotation shafts120 and 130, and the fourth to sixth seal rings 154, 155, and 156 frommoving toward the vacuum chamber 11 with respect to the second rotationshaft 130 and the support member 140. In this embodiment of the sealingmechanism, the stop means is constituted by first to third rings 191,192, and 193 which are fastened selectively to the first and secondrotation shafts 120 and 130 to respectively stop the first to third sealrings 151, 152, and 153 from moving toward the vacuum chamber 11, andfourth to sixth rings 194, 195, and 196 which are fastened selectivelyto the second rotation shaft 130 and the support member 140 torespectively stop the fourth to sixth seal rings 154, 155, and 156 frommoving toward the vacuum chamber 11.

To ensure that the frictions between the first to third seal rings 151,152, and 153 and the first rotation shaft 120, between the first tothird seal rings 151, 152, and 153 and the second rotation shaft 130,between the fourth to sixth seal rings 154, 155, and 156 and the secondrotation shaft 130, and between the fourth to sixth seal rings 154, 155,and 156 and the support member 140 are reduced to a minimum level, as asmall level as possible, the outer surface 120 a of the first rotationshaft 120, the inner surface 130 a of the second rotation shaft 130, theouter surface 130 d of the second rotation shaft 130, and the innersurface 140 a of the support member 140 are coated with atetrafluoroethylene layer.

As will be seen in FIGS. 3 to 5, each of the first, second, fourth, andfifth seal rings 151, 152, 154, and 155 comprises an annular retainingmember 101 formed with an annular groove 101 a, and an annular springmember 102 tightly received in the annular groove 101 a and retained bythe annular retaining member 101 to resiliently bias the annularretaining member 101 to expand radially outwardly.

The annular retaining member 101 is made of a resilient material and theannular spring member 102 is made of a metal. The above-mentionedresilient material includes rubber and synthetic resin mainly containinga polyethylene. The annular spring member 102 is made of a strip in theform of a helical shape. The annular spring member 102 is covered by theannular retaining member 101. Each of the first, second, fourth, andfifth seal rings 151, 152, 154, and 155 has a center axis 101 b passingtherethrough and is of a circular cross-section taken on the planeperpendicular to the center axis 101 b.

While each of the first, second, fourth, and fifth seal rings 151, 152,154, and 155 comprises an annular retaining member 101 and an annularspring member 102 which are shown in FIGS. 3 to 5 in this embodiment,the first, second, fourth, and fifth seal rings 151, 152, 154, and 155may comprise an annular retaining member 103 and an annular springmember 104 which are shown in FIGS. 6 to 8 in place of the annularretaining member 101 and the annular spring member 102 which are shownin FIGS. 3 to 5 according to the present invention.

As will be seen in FIGS. 6 to 8, each of the first, second, fourth, andfifth seal rings 151, 152, 154, and 155 comprises an annular retainingmember 103 formed with an annular groove 103 a, and an annular springmember 104 tightly received in the annular groove 103 a and retained bythe annular retaining member 103 to resiliently bias the annularretaining member 103 to expand radially outwardly.

The annular retaining member 103 is made of a resilient material and theannular spring member 104 is made of a metal. The above-mentionedresilient material includes rubber and synthetic resin mainly containinga polyethylene. The annular spring member 104 is made of a strip in theform of a helical shape. The annular spring member 104 is covered by theannular retaining member 103. Each of the first, second, fourth, andfifth seal rings 151, 152, 154, and 155 has a center axis 103 b passingtherethrough and is of a triangular cross-section taken on the planeperpendicular to the center axis 103 b.

As will be seen in FIGS. 9 to 11, each of the third and sixth seal rings153 and 156 comprises an annular retaining member 105 formed with anannular groove 105 a, and an annular spring member 106 tightly receivedin the annular groove 105 a and retained by the annular retaining member105 to resiliently bias the annular retaining member 105 to expandradially outwardly.

The annular retaining member 105 is made of a resilient material and theannular spring member 106 is made of a metal. The above-mentionedresilient material includes rubber and synthetic resin mainly containinga polyethylene. The annular spring member 106 is made of a strip in theform of a helical shape. The annular spring member 106 is covered by theannular retaining member 105. Each of the third and sixth seal rings 153and 156 has a center axis 105 b passing therethrough and is of achannel-shaped cross-section taken on the plane perpendicular to thecenter axis 105 b. As best shown in FIG. 12, the annular groove 105 a ofthird seal ring 153 has an end open toward the second fluid chamber 162and the annular groove 105 a of sixth seal ring 156 has an end opentoward the fourth fluid chamber 164.

The operation of the sealing mechanism will be described hereinlater.

The vacuum chamber 11 of the semiconductor producing apparatus isusually controlled to be vacuumized to the pressure level for example at5×10⁻⁴ Pa while the semiconductor producing apparatus is being operated.At this time, the pressure of the second and fourth fluid chambers 162and 164 are maintained at a pressure level substantially equal to thatof the vacuum chamber 11. This results in having the pressure 1×10⁵ Paof the atmosphere 10 and the pressure 5×10⁻⁴ Pa of the vacuum chamber 11differ from each other at an extremely high level, for example,1×10⁵-5×10⁻⁴ Pa. This pressure difference leads to generating an axialforce to move the seal rings toward the vacuum chamber 11, with theresult that the first to sixth seal rings 151 to 156 are liable toabruptly be displaced from their respective home positions if externalforces such as for example vibrations are generated from othermechanical elements or parts forming the semiconductor producingapparatus. The abrupt displacements of the first to sixth seal rings 151to 156 may cause dusts and other foreign materials to enter the vacuumchamber 11 as well as may bring about the pressure fluctuation in thevacuum chamber 11, thereby lessening the productivity of thesemiconductor.

In the second embodiment of the sealing mechanism mentioned in theabove, there is provided the first and second fluid chambers 161 and 162axially juxtaposed between the first rotation shaft 120 and the secondrotation shaft 130 to overcome the above problems the prior artencounters, and there is provided the third and fourth fluid chambers163 and 164 axially juxtaposed between the second rotation shaft 130 andthe support member 140 to overcome the above problems the prior artencounters. The first and third fluid chambers 161 and 163 are suckedthrough the third fluid passageway 141 by the air sucking unit 170 to bemaintained at a pressure lower than the atmospheric pressure but higherthan those of the second and fourth fluid chambers 162 and 164 and thevacuum chamber 11. It is thus to be noted that the dusts and otherforeign materials are discharged and sucked through the third fluidpassageway 141 by the air sucking unit 170 while the pressure of thefirst and third vacuum chambers 161 and 163 are maintained at theseoptimum pressure level, i.e., lower than the atmospheric pressure buthigher than those of the second and fourth fluid chambers 162 and 164and the vacuum chamber 11 to prevent the abrupt pressure drop in thevacuum chamber 11. This function of the first and third fluid chambers161 and 163 are cooperated with the function of the second and fourthfluid chambers 162 and 164 to enhance the effectiveness of the sealingmechanism according to the present invention.

From the above description, it will be understood that the first tosixth seal rings 151 to 156 work together to prevent dusts and otherforeign materials from entering the vacuum chamber 11 as well as toprevent the pressure of the vacuum chamber 11 from dropping over itsallowable level. More specifically, the first, second, and third sealrings 151, 152, and 153 axially spaced apart from each other to form thefirst and second fluid chambers 161 and 162 can result in the fact thatthe dusts and other foreign materials entering the first fluid chamber161 can be removed through the first fluid passageway 131 by the airsucking unit 170 to prevent the dusts and other foreign materials fromentering the second fluid chamber 162 and the vacuum chamber 11 whilethe pressure of the vacuum chamber 11 is not dropped rapidly due to thefirst and second fluid chambers 161 and 162 provided between the vacuumchamber 11 and the atmosphere 10. The fourth, fifth, and sixth sealrings 154, 155, and 156 axially spaced apart from each other to form thethird and fourth fluid chambers 163 and 164 can result in the fact thatthe dusts and other foreign materials entering the third fluid chamber163 can be removed through the third fluid passageway 141 by the airsucking unit 170 to prevent the dusts and other foreign materials fromentering the fourth fluid chamber 164 and the vacuum chamber 11 whilethe pressure of the vacuum chamber 11 is not dropped rapidly due to thethird and fourth fluid chambers 163 and 164 provided between the vacuumchamber 11 and the atmosphere 10.

In a usual manner, the sealing mechanism is operated to have the secondseal ring 152 serve as completely sealing between the second seal ring152 and the second rotation shaft 130 and between the second seal ring152 and the first rotation shaft 120, and to have the fifth seal ring155 serve as completely sealing between the fifth seal ring 155 and thesupport member 140 and between the fifth seal ring 155 and the secondrotation shaft 130. Sometimes, there occur vibrations and othermechanical motions of the elements or parts of the semiconductorproducing apparatus to impart shocks to the second and fifth seal rings152 and 155. When such the vibrations and other mechanical motions ofthe elements or parts of the semiconductor producing apparatus aregenerated, the small gaps are formed between the second seal ring 152and the second rotation shaft 130, between the second seal ring 152 andthe first rotation shaft 120, between the fifth seal ring 155 and thesupport member 140, and between the fifth seal ring 155 and the secondrotation shaft 130. The small gaps between the second seal ring 152 andthe second rotation shaft 130 and between the second seal ring 152 andthe first rotation shaft 120 lead to introducing the air in the firstfluid chamber 161 into the second fluid chamber 162 because the pressureof the first fluid chamber 161 is always maintained at a level higherthan that of the second fluid chamber 162. The small gaps between thefifth seal ring 155 and the support member 140 and between the fifthseal ring 155 and the second rotation shaft 130 lead to introducing theair in the third fluid chamber 163 into the fourth fluid chamber 164because the pressure of the third fluid chamber 163 is always maintainedat a level higher than that of the fourth fluid chamber 164. The airentering the second and fourth fluid chambers 162 and 164 comes to beequal in pressure to the air in the vacuum chamber 11 by the reason thatthe second and fourth fluid chambers 162 and 164 are held incommunication with the vacuum chamber 11 through the filter 180. If, atthis time, the air introduced into the second and fourth fluid chambers162 and 164 happen to contain dusts and other foreign materials, thesematerials are prevented from entering the vacuum chamber 11 by thefilter 180 and by no means fly and scatter in the air of the vacuumchamber 11.

On the other hand, the aforementioned fact that the air entering thesecond fluid chamber 162 becomes equal in pressure to the air in thevacuum chamber 11 means that the third seal ring 153 between the secondfluid chamber 162 and the vacuum chamber 11 does not undergo anypressure, i.e., axial force caused in the second fluid chamber 162 andthe vacuum chamber 11, thereby making it possible to completely preventthe air in the second fluid chamber 162 from entering the vacuum chamber11 through the gap between the third seal ring 153 and the secondrotation shaft 130 and between the third seal ring 153 and the firstrotation shaft 120. The aforementioned fact that the air entering thefourth fluid chamber 164 becomes equal in pressure to the air in thevacuum chamber 11 means that the sixth seal ring 156 between the fourthfluid chamber 164 and the vacuum chamber 11 does not undergo anypressure, i.e., axial force caused in the fourth fluid chamber 164 andthe vacuum chamber 11, thereby making it possible to completely preventthe air in the fourth fluid chamber 164 from entering the vacuum chamber11 through the gap between the sixth seal ring 156 and the supportmember 140 and between the sixth seal ring 156 and the second rotationshaft 130. No axial force and pressure imparted on the third seal ring153 can render the contacting pressure on the second rotation shaft 130and the first rotation shaft 120 extremely small in value so that nodusts is generated by the friction between the third seal ring 153 andthe second rotation shaft 130 and between the third seal ring 153 andthe first rotation shaft 120. No axial force and pressure imparted onthe sixth seal ring 156 can render the contacting pressure on thesupport member 140 and the second rotation shaft 130 extremely small invalue so that no dusts is generated by the friction between the sixthseal ring 156 and the support member 140 and between the sixth seal ring156 and the second rotation shaft 130.

According to the present invention, the circular cross-sectioned sealring shown in FIGS. 3 to 5 or the triangular cross-sectioned seal ringshown in FIGS. 6 to 8 can be used for the first and second seal rings 51and 52 in the first embodiment of the seal mechanism shown in FIGS. 1and 2 and the first, second, fourth, and fifth seal rings 151, 152, 154,and 155 in the second embodiment of the seal mechanism shown in FIGS. 12to 14. In general, the circular cross-sectioned seal ring is larger inspring constant than the triangular cross-sectioned seal ring. Thismeans that the surface pressure of the circular cross-sectioned sealring is larger than that of the triangular cross-sectioned seal ring andthat the circular cross-sectioned seal ring is more easily worn than thetriangular cross-sectioned seal ring. The abrasion ratio of thetriangular cross-sectioned seal ring is smaller than that of thecircular cross-sectioned seal ring, thereby making it possible for thetriangular cross-sectioned seal ring to withstand longer than that ofthe circular cross-sectioned seal ring. Moreover, the surface pressureof the triangular cross-sectioned seal ring can be reduced to the extentsmaller than that of the circular cross-sectioned seal ring for a giventime period. From this reason, the triangular cross-sectioned seal ringcan withstand for a longer period than that of the circularcross-sectioned seal ring. In view of the characteristics of thetriangular cross-sectioned seal ring and the circular cross-sectionedseal ring, it is preferable that the seal ring mechanism be designed andproduced.

While the subject invention has been described with relation to thepreferred embodiments, various modifications and adaptations thereofwill now be apparent to those skilled in the art as far as suchmodifications and adaptations fall within the scope of the appendedclaims intended to be covered thereby.

What is claimed is:
 1. A combination of a vacuum chamber formed in asemiconductor producing apparatus and a sealing mechanism for sealingsaid vacuum chamber, said sealing mechanism comprising: a first rotationshaft driven to be rotatable around its own axis and having an outersurface in the form of a cylindrical shape; a hollow second rotationshaft driven to be rotatable around its own axis and having said firstrotation shaft rotatably received therein, said second rotation shafthaving first and second axial ends respectively extending in theatmosphere and said vacuum chamber, and inner and outer surfaces each inthe form of a cylindrical shape, said inner surface of said secondrotation shaft being larger in diameter than said outer surface of saidfirst rotation shaft; a support member intervening between said vacuumchamber and the atmosphere and rotatably supporting said first andsecond rotation shafts received therein, said support member having aninner surface in the form of a cylindrical hollow shape and first andsecond axial ends respectively extending in the atmosphere and saidvacuum chamber, said inner surface of said support member being largerin diameter than the outer surface of said second rotation shaft; afirst seal ring positioned between said first and second rotation shaftsto hermetically seal the gap between said first and second rotationshafts; and an additional seal ring positioned between said secondrotation shaft and said support member to hermetically seal the gapbetween said second rotation shaft and said support member; each of saidfirst seal ring and said additional seal ring comprising an annularretaining member formed with an annular groove, and an annular springmember tightly received in said annular groove and retained by saidannular retaining member to resiliently bias said annular retainingmember to expand radially outwardly.
 2. A combination of a vacuumchamber formed in a semiconductor producing apparatus and a sealingmechanism for sealing said vacuum chamber, said sealing mechanismcomprising: a first rotation shaft driven to be rotatable around its ownaxis and having an outer surface in the form of a cylindrical shape; ahollow second rotation shaft driven to be rotatable around its own axisand having said first rotation shaft rotatably received therein, saidsecond rotation shaft having first and second axial ends respectivelyextending in the atmosphere and said vacuum chamber, and inner and outersurfaces each in the form of a cylindrical shape, said inner surface ofsaid second rotation shaft being larger in diameter than said outersurface of said first rotation shaft; a support member interveningbetween said vacuum chamber and the atmosphere and rotatably supportingsaid first and second rotation shafts to have said first and secondrotation shafts received therein, said support member having an innersurface in the form of a cylindrical hollow shape and first and secondaxial ends respectively extending in the atmosphere and said vacuumchamber, said inner surface of said support member being larger indiameter than the outer surface of said second rotation shaft; a pair ofseal rings positioned between said first and second rotation shafts tohermetically seal the gap between said first and second rotation shafts;and an additional pair of seal rings positioned between said secondrotation shaft and said support member to hermetically seal the gapbetween said second rotation shaft and said support member; each of saidseal rings comprising an annular retaining member formed with an annulargroove, and an annular spring member tightly received in said annulargroove and retained by said annular retaining member to resiliently biassaid annular retaining member to expand radially outwardly.